Summary
Overview
Work History
Education
Skills
Certification
Timeline
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Chyann Lassig

Clinton,UT

Summary

Dynamic Lead Technician with a proven track record at T2 Engineering, showcasing expertise in BGA rework and exceptional quality assurance. Excelled in micro soldering and surface mount technology, significantly enhancing product reliability. Demonstrated leadership in maintaining high standards and efficiency in complex assembly processes. Renowned for meticulous attention to detail and a relentless drive for excellence.

Overview

15
15
years of professional experience
1
1
Certification

Work History

Lead Technician

T2 Engineering
Kaysville, UT
07.2024 - Current
  • Assembled electronic components by hand, using soldering irons and other tools.
  • Inspected assembled products for any defects or malfunctions.
  • Read and followed blueprints, diagrams, schematics, and technical manuals to assemble electronics.
  • Maintained a clean and organized work area at all times.
  • Operated automated assembly equipment in accordance with safety regulations.
  • Interpreted engineering drawings accurately when assembling complex systems.
  • Used soldering equipment and wiring to assemble electrical and electronic systems.
  • Collected finished assemblies and prepared for shipment.

Rework/ Solder Tech

Sanmina
West Valley City, UT
06.2018 - 05.2024
  • Performed surface mount soldering to complete printed circuit board patterns.
  • Cleaned and examined components at various production stages.
  • Interpreted assembly drawings and specifications accurately.
  • Replaced defective parts such as motors, switches, relays, sensors, circuit boards and wiring harnesses.
  • Conducted testing of circuit boards, assemblies, and systems to ensure product reliability.

Lead/ Solder Tech

EMS Solutions
Ogden, UT
01.2010 - 01.2017
  • Operated automated machinery used to assemble surface mount components onto circuit boards.
  • Tracked and maintained circuit board and soldering stock levels, making sure needed materials remained available.
  • Loaded parts into feeders, aligned them properly, and programmed machines accordingly.
  • Performed soldering tasks on surface mount components using a microscope and tweezers.
  • Inspected finished products for any defects or discrepancies in quality standards.

Education

High School Diploma -

Layton High School
Layton, UT
06.2002

Some College (No Degree) - Electronic Assembly And Soldering

Davis Applied Technology College
Kaysville, UT

Skills

BGA rework

Pad and trace repair

Micro soldering

Through hole and Surface mount

Wire and terminal

Operation of SMT machines

Quality assurance

Certification

Certified IPC Specialist

IPC J-STD-001 EXP 2023

IPC-A-610 EXP 2023

Timeline

Lead Technician

T2 Engineering
07.2024 - Current

Rework/ Solder Tech

Sanmina
06.2018 - 05.2024

Lead/ Solder Tech

EMS Solutions
01.2010 - 01.2017

High School Diploma -

Layton High School

Some College (No Degree) - Electronic Assembly And Soldering

Davis Applied Technology College

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Chyann Lassig