Honggun Kim

Experienced technology leader with over 20 years of work experience at TEL, Applied Materials, and Samsung Electronics. Managed internal teams and cross-department teams of 20+ process and hardware engineers. Successfully engaged and qualified the devices of multiple process development, including multiple PECVD and PEALD. Additionally, served as the PECVD/PEALD strategy leader and roadmap at TEL, driving novel product development and engagements. As the customer application technology leader at Applied Materials, successfully engaged overall PECVD products through close collaboration with customers and cross-functional work. Also, served as CVD manager at Samsung Electronics, managing engineers, and leading device TFT of Memory and Logic with hands-on experience in process improvement and material characterization. Also, served as the Samsung TRM leader with Applied Materials and IPS, successfully engaging in JDP/JEP. Wide global experience, having worked at the IMEC consortium in Belgium, Applied Materials in the US, and TEL in Japan, to broaden cultures and work styles.