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9+ years of experience in semiconductor packaging, package design for case/over-molded power modules, 3-D packaging, fabrication/assembly process design/development, packaging material Expertise in reliability/failure mode analysis using thermal shock/cycling, die shear, power cycling, HTRB/H3TRB, cross-section (x-section) of semiconductor devices, packages Skills in various industrial and automotive standards AQG-324, AEC-Q101/100, MIL, JEDEC, IEC Hands-on expertise in multi-chip modules, SMT, flip-chip solder bumping, underfills for flip-chip, solder paste/preform/ball for die/component attach, reflow, wire bonding, encapsulation, passivation Experience in test vehicle design for experimental research using design of experiment (DOE) in JMP, R Expertise in injection molded design, insert molded design Expertise in packaging materials: power substrate, die attach, sintering, molding compound, interconnect technologies Expertise in package modeling and electrical/thermal/structural/virtual reliability multiphysics simulations using ANSYS, COMSOL Skills in semiconductor characterization tools: CSAM, X-ray Adept in VNA, TDR, curve tracer, oscilloscope, spectrum analyzer, impedance analyzer Authored and co-authored twelve technical publications Technical problem solver, cross-functional team player, excellent technical writing, communication skills Led student organization as president, executed successful fundraising drive

 Dynamic and results-driven Mechanical Engineer with over a decade of experience specializing in engineering design and analysis. Core expertise lies in simulation-driven design utilizing both thermal and mechanical computational tools. Proficient in leading design teams for product research and development, with exposure to prototyping, testing, and analytical validations. Demonstrated ability to successfully drive projects from concept to implementation, leveraging advanced simulation techniques to optimize product performance and efficiency. 

Accomplished Mechanical Engineer with a proven track record at Burgess Manufacturing, specializing in structural analysis and project planning. Demonstrates exceptional leadership and problem-solving aptitude, significantly enhancing team performance and driving innovative solutions. Expert in reducing engineering project costs, underscored by adeptness in technical writing and interpersonal communication. Beyond well adept in CAD and G code. A proven professional that has products that I designed and are now being sold by big corporations

Dedicated and results-driven Transport Planner and Modeler with nearly 12 years of comprehensive experience in industry research settings. Possessing a Ph.D. in Transport and Land Use Modeling from the University of Wollongong (Australia) and a Chartered Member of the Chartered Institute of Transport and Logistics (CILT). My expertise extends to both national and international transport projects, where I have consistently demonstrated strong organizational skills, motivation, and a commitment to delivering impactful results. Proven ability to navigate complex challenges and contribute valuable insights to optimize transport systems. A forward-thinking professional with a track record of excellence in the field.

Izhar Izhar

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