Masa Higashitani

With over 35 years of experience in the semiconductor industry, successfully driving numerous projects from inception to final product. Expertise in DRAM, NOR Flash Memory, 2D-NAND & 3D-NAND Flash memory devices, process integration, and reliability. Proven track record of driving new technology development, including Wafer-Wafer Bonding technology, MLC operation, New Memory Architecture (LLF: Low Latency Flash), Analog Memory, and more. Possess the ability to effectively coordinate business requirements with technical challenges for seamless alignment. Excelled in coordinating and interfacing among design, device, process, and package teams throughout career. Extensive experience in engaging businesses in technology development and transfer, as well as product manufacture. Involved in numerous joint-venture projects between Japanese semiconductor companies and US-based organizations. Excellent interpersonal and teamwork skills, along with strong problem-solving techniques and innovative ideas. Contributed to the creation of over 200 patents.