Dayna Moyer
Mechanical Engineer
Matawan,NJ
Summary
Collaborative Mechanical Engineering Senior at RPI with varied internship experience. Dependable candidate excited to leverage my technical background and passions and continue my education in order to build a long term professional career in Process Engineering in the Semiconductor industry.
Overview
1
1
year of professional experience
Work History
Mechanical Engineering Intern
Applied Materials
Albany Nanotech Center, Albany NY
05.2023 - 08.2023
- Performed preventative maintenance on numerous semiconductor tools including CMP, Etch, and PVD/ALD tools
- Managed chemical inventory organization and efficiency
- Optimized financial return of ampoule and slurry usage.
Electrical Engineering Intern
Curia Global, Inc.
Rensselaer, NY
06.2022 - 08.2022
- Designed a software program to calculate water totals in and out of buildings.
- Updated facility electrical drawings using AUTO/CAD
- Updated health and safety protocol documentation.
- Shadowed numerous team members in the plant and worked directly on drug manufacturing equipment
Integrated Testbed Research Team Member
Rensselaer Polytechnic Institute
01.2023 - 04.2023
- Designed control schematics for Thermoelectric Assembly control using Arduino
- Worked with team of RPI Professors and other engineering students
Education
Bachelor of Science - Mechanical Engineering
Rensselaer Polytechnic Institute
Troy, NY 05.2020 - 05.2024
Skills
3D PrintingArduinoPython
Semi Conductor Wafer Manufacturing
Coursework & Activities
- Advanced Materials Science and Semiconductor Manufacturing
- Strength of Materials
- Physics II
- Thermodynamics
- CAD
Timeline
Mechanical Engineering Intern
Applied Materials
05.2023 - 08.2023
Integrated Testbed Research Team Member
Rensselaer Polytechnic Institute
01.2023 - 04.2023
Electrical Engineering Intern
Curia Global, Inc.
06.2022 - 08.2022
Bachelor of Science - Mechanical Engineering
Rensselaer Polytechnic Institute
05.2020 - 05.2024