Colin Madrid

• Navigated local routes efficiently, ensuring timely arrivals for passengers.
• Provided excellent customer service, addressing passenger inquiries and concerns promptly.
• Maintained vehicle cleanliness and performed routine inspections for safety compliance.
• Adapted to changing schedules and traffic conditions to optimize ride experiences.

• Provided reliable transportation services for Lyft Corporation, prioritizing customer satisfaction and timely arrivals.

• The process engineer position owns the process development of the polishing and post-polishing processes that are cutting edge for customers who are developing wafer processes for a variety of substrates and wafer types. Wafer types may be small (2"-4"), to large (12"). Work with novel substrates and compounds done on a semiregular basis which results in new process development.

• Managed project completion deadlines during transfer of new semiconductor polishing pads projects from development to manufacturing. Worked with project stakeholders (engineers) to ensure projects finished development.

Managed process improvement in semiconductor manufacturing at the Intel Ocotillo site by reducing defectivity, troubleshooting equipment failures, fine-tuning process parameters, and automating routine procedures. Gained hands-on experience troubleshooting optical, electro-mechanical, robotic, and closed-loop control systems pertaining to the wafer polishing process. Other key activities included interpreting and visualizing large datasets using statistical methods and software, creating and updating maintenance procedures, performing qualification of newly installed processing equipment, interfacing with cross-functional engineering teams, and providing training to technicians and other engineers. Participated in Kaizen meetings at the factory level. Managed multiple engineers in day to day tasks. Worked as a touch-point for engineers when it came to knowledge of CMP layers. Provided solutions to process defects and found ways to optimize the wafer process.

• Experience processing silicon wafers in a Class 100 clean room environment. Processing included cleaning, spin-coating photoresist, masking, reactive ion etching, thermal oxidation, and deposition of layers by plasma enhanced chemical vapor deposition (PECVD).
• MSE 447L

• Prepared samples for electron microscopy by slicing, sputter-coating, and mounting as well as operating SEM w/EDS. Selected optimal electron microscope settings during materials analysis, to determine compositional characteristics using energy dispersive spectroscopy (EDS) and produce optimal images for presentation.