Dynamic management with extensive experience in process development and production, focusing on cutting-edge technologies in nano imprinting and 3D display field.
Demonstrated ability to build and lead engineering teams in high-stakes environments while implementing state-of-the-art manufacturing standards. Passionate about advancing technology transfer and industrialization within the field, consistently contributing to enhanced operational performance and product quality.
Proven expertise in failure analysis, data analysis, metrology, process development and manufacturing industrialization.
Overview
17
17
years of professional experience
Work History
Senior Manager
Leiainc
04.2023 - Current
Design process routines for mastering and stamps to ensure Leia's new product launch, provide working stamps without defects for large scale imprinting from G3 to G5 size
Lead material development team to develop new UV resin to meet design and process requirements,
Handled global project management with internal team and vendors across the Netherlands, China, US, and UK.
Reduced costs, optimized resource allocation, and improved efficiency in managing projects.
Manager
Leiainc
01.2020 - 03.2023
Build an engineering team to development process and start fabrication for mass production
manage MSD (manufacturing standardization development) and ATD (advanced technique development) to meet Leia's product strategy.
Senior Engineer
Leiainc
08.2018 - 12.2019
Perform analysis and process development to support imprint production team increasing yield.
Work with core team in Silicon valley to conduct advanced technique research and process-to-manufacture transfer.
Streamlined engineering processes, improving efficiency and reducing project timelines.
Senior Failure Analysis Engineer
Seagate
05.2011 - 08.2018
Provide opportunities for improved head processes and design through consistent and accurate determination of the root cause of head failures in drive across the supply chain in coordination with Head Design Teams, Drive Centers, Program Management, and Manufacturing sites.
Perform Head Electrical/Magnetic/Mechanical FA on all post process failures and determine root cause by using FA techniques and tools like ISI, ET, Probe-meter and other electric parameter testing, AFM, SEM for mechanical dimension measurement and analysis.
Data analysis on upstream parameter and in-process test by using minitab and JMP, Work with various groups to develop corrective actions and follow through the implementations.
Failure Analysis Engineer
TPO Display
09.2008 - 05.2011
In charge of the failure analysis of LCD module from various customers including Nokia, Moto, Apple, RIM and Huawei, perform electrical and physical failure analysis from new project, multi-products and customer rejects by using Use DMM, OSC, Semiconductor parameter contact with Micro_probe, SEM, EDS and cross-section.
Maintain the FACA (Failure analysis & Corrective action) system, perform equipment maintenance, support lab management to compliance with TS16949 quality system.
Develop team members with FA knowledge and skill, to bring them to higher competence level.
Education
Master of Science - Engineering Management
Nanjing University
06-2026
Bachelor of Science - Electrical, Electronics And Communications Engineering
Nanjing University of Science And Technology
07-2008
Skills
Strategic planning
Cross-functional team coordination
Data-driven decision making
Troubleshooting and problem resolution
Timeline
Senior Manager
Leiainc
04.2023 - Current
Manager
Leiainc
01.2020 - 03.2023
Senior Engineer
Leiainc
08.2018 - 12.2019
Senior Failure Analysis Engineer
Seagate
05.2011 - 08.2018
Failure Analysis Engineer
TPO Display
09.2008 - 05.2011
Master of Science - Engineering Management
Nanjing University
Bachelor of Science - Electrical, Electronics And Communications Engineering