Open To Work
Ruliang Lee
Camas,WA
Work Preference
Summary
A deep commitment to advancing semiconductor technologies is demonstrated through extensive leadership experience in both R&D and operations management. Proven success in driving innovation and optimizing processes across various semiconductor applications aligns with the goal of fostering cutting-edge advancements. With a solid engineering background complemented by strong communication skills, a passion for collaborative problem-solving and impactful contributions to industry evolution is demonstrated.
Overview
2
2
Languages
32
32
years of professional experience
Work History
President
TSMC Washington
Camas, United States
08.2023 - 07.2026
- Formulated long-term growth strategies, enhancing market presence and securing revenue growth through targeted initiatives.
- Built high-performance team by identifying talent and implementing mentoring initiatives to foster development.
- Directed senior management in defining and achieving organizational goals, surpassing customer expectations through strategic alignment.
Director, Specialty Module Division, R&D
TSMC
Hsinchu, Taiwan
06.2013 - 07.2023
- Managed module processes for all specialty technologies.
- Delivered industry-leading multi-wafer stacking technology for CIS and logic.
- Developed switching layer materials and cell patterning for new memory technologies in MRAM, RRAM, PCRAM, CBRAM.
- Led GAN-on-Si epitaxy development for power devices.
- Delivered in-house BE-SOI process to minimize RF substrate costs.
- Drive silicon photonics process development to lead the next-generation AI server market.
- Engineered MEMS devices, focusing on piezoelectric audio components and differential optical elements.
Deputy Director, Backend Technology and Service Division
TSMC
Hsinchu, Taiwan
11.2010 - 06.2013
- Managed daily bumping line operations and transfer of advanced packing technology into manufacturing.
- Delivered exceptional yield on pilot advanced packaging (CoWoS) production for an industry-leading FPGA customer.
Deputy Fab Director, Fab 12A
United Microelectronics Corporation (UMC)
Tainan, Taiwan
10.2003 - 10.2010
- Oversaw all modules and integration from 2006 to 2010.
- Managed receiving leading-node technologies (90/65/40 nm) from UMC R&D.
- Spearheaded volume ramp-up efforts to meet rising demand.
Director, Key Account Technology
Novellus Systems acquired by Lam Research Corporation
Hsinchu, Taiwan
04.2001 - 10.2003
- Managed key accounts for TSMC and UMC, driving continuous improvement initiatives.
- Enhanced problem-solving efforts across installed-base operations to maximize efficiency.
- Drove new tool penetration through comprehensive knowledge of company portfolio.
- Utilized strong communication skills to effectively bridge headquarters with customer needs.
Etch/Litho Manager
TSMC Washington
Camas, United States
05.1997 - 04.2001
- Recognized with promotion from etch engineer to etch process manager within one year.
- Assigned to lead etch equipment team of mainly American engineers after one year leading the process team, delivering significant improvement in team performance.
- Transitioned to lithography process manager role after six months as part of career development plan initiated by supervisor.
Development Engineer
Applied Materials
Santa Clara, United States
02.1994 - 03.1997
- Member of the development team for industry's first inductively-coupled plasma dielectric etcher.
- Accumulated leading-edge knowledge in both hardware and process technologies of semiconductor equipment.
- Led first tool installation in US and Asia sites starting 1996, achieving smooth start-ups and earning customer recognition.
Education
Ph.D. - Electrical Engineering
University of Michigan
Ann Arbor, MI05-1993
Skills
- Strategic planning
- Team leadership and coaching
- Project management and execution
- Technical development and support
- Customer relationship management
- Problem solving and analysis
- Change management
- Organizational leadership
Languages
English
Full Professional
Chinese (Mandarin)
Full Professional
Timeline
President
TSMC Washington
08.2023 - 07.2026
Director, Specialty Module Division, R&D
TSMC
06.2013 - 07.2023
Deputy Director, Backend Technology and Service Division
TSMC
11.2010 - 06.2013
Deputy Fab Director, Fab 12A
United Microelectronics Corporation (UMC)
10.2003 - 10.2010
Director, Key Account Technology
Novellus Systems acquired by Lam Research Corporation
04.2001 - 10.2003
Etch/Litho Manager
TSMC Washington
05.1997 - 04.2001
Development Engineer
Applied Materials
02.1994 - 03.1997
Ph.D. - Electrical Engineering
University of Michigan